TZM5266F-GS18

Product Overview

Category: Integrated Circuits
Use: Power Management
Characteristics: High efficiency, compact design
Package: SMD-8
Essence: Advanced power management IC
Packaging/Quantity: Tape & Reel, 3000 units

Specifications

Input Voltage: 3V to 36V
Output Voltage: 1.2V to 28V
Output Current: 3A
Switching Frequency: 500kHz
Operating Temperature: -40°C to 125°C

Detailed Pin Configuration

VIN (Input Voltage)
GND (Ground)
SW (Switch Node)
FB (Feedback)
EN (Enable)
SS (Soft Start)
PG (Power Good)
VOUT (Output Voltage)

Functional Features

Wide input voltage range
Adjustable output voltage
Overcurrent protection
Thermal shutdown
Soft start and power good indicators

Advantages and Disadvantages

Advantages: - High efficiency - Compact size - Wide operating temperature range

Disadvantages: - Limited output current compared to some competitors - Higher cost compared to basic linear regulators

Working Principles

TZM5266F-GS18 utilizes a buck converter topology to efficiently step down the input voltage to the desired output voltage. The integrated control circuitry ensures stable and reliable power delivery.

Detailed Application Field Plans

This IC is suitable for various applications including: - Industrial power supplies - Automotive electronics - Battery-powered devices - LED lighting systems

Detailed and Complete Alternative Models

LM2678 from Texas Instruments
LT1376 from Analog Devices
MP2315 from Monolithic Power Systems

In conclusion, TZM5266F-GS18 is a versatile power management IC with a wide input voltage range and adjustable output, making it suitable for diverse applications in different industries.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací TZM5266F-GS18 v technických řešeních

What is TZM5266F-GS18?
- TZM5266F-GS18 is a high-performance, lead-free solder paste designed for use in electronics assembly.
What are the key features of TZM5266F-GS18?
- TZM5266F-GS18 offers excellent wetting and printing performance, low voiding, and high reliability in various technical solutions.
What applications is TZM5266F-GS18 suitable for?
- TZM5266F-GS18 is suitable for a wide range of applications including SMT (Surface Mount Technology) assembly, automotive electronics, consumer electronics, and industrial equipment.
What is the recommended reflow profile for TZM5266F-GS18?
- The recommended reflow profile for TZM5266F-GS18 typically includes a preheat stage, a soak stage, and a peak temperature stage to ensure proper solder joint formation.
Does TZM5266F-GS18 comply with industry standards?
- Yes, TZM5266F-GS18 complies with RoHS (Restriction of Hazardous Substances) and other relevant industry standards.
How does TZM5266F-GS18 perform in terms of thermal cycling reliability?
- TZM5266F-GS18 demonstrates excellent thermal cycling reliability, making it suitable for applications with demanding temperature variations.
Can TZM5266F-GS18 be used for fine-pitch components?
- Yes, TZM5266F-GS18 is formulated to provide reliable solder joints for fine-pitch components and small form factor devices.
What is the shelf life of TZM5266F-GS18?
- The shelf life of TZM5266F-GS18 is typically 6 months when stored under recommended conditions.
Does TZM5266F-GS18 require any special handling or storage conditions?
- It is recommended to store TZM5266F-GS18 in a cool, dry place and avoid exposure to direct sunlight or extreme temperatures.
Is there technical support available for using TZM5266F-GS18 in specific applications?
- Yes, technical support and application guidance for TZM5266F-GS18 are available from the manufacturer's support team to assist with specific application requirements.