LM3S2412-IQC25-A2

Product Overview

Category: Microcontroller

Use: The LM3S2412-IQC25-A2 is a microcontroller designed for embedded systems applications. It provides a wide range of features and capabilities to support various electronic devices and systems.

Characteristics: - High-performance ARM Cortex-M3 core - 32-bit RISC architecture - Clock speed up to 50 MHz - Flash memory size of 128 KB - RAM size of 8 KB - Integrated peripherals such as UART, SPI, I2C, GPIO, etc. - Low power consumption - Small form factor

Package: The LM3S2412-IQC25-A2 comes in a compact quad flat package (QFP) with 100 pins, making it suitable for space-constrained applications.

Essence: This microcontroller serves as the brain of electronic devices, controlling their operation and facilitating communication between different components.

Packaging/Quantity: The LM3S2412-IQC25-A2 is typically sold in reels or trays containing multiple units. The exact quantity depends on the manufacturer's packaging specifications.

Specifications

• Microcontroller Family: LM3S
• Model Number: 2412-IQC25-A2
• Processor Core: ARM Cortex-M3
• Clock Speed: Up to 50 MHz
• Flash Memory Size: 128 KB
• RAM Size: 8 KB
• Operating Voltage: 2.7V - 3.6V
• Operating Temperature Range: -40°C to +85°C
• Integrated Peripherals: UART, SPI, I2C, GPIO, Timers, ADC, PWM, etc.
• Package Type: Quad Flat Package (QFP)
• Package Pins: 100
• Dimensions: 14mm x 14mm

Detailed Pin Configuration

The LM3S2412-IQC25-A2 has a total of 100 pins, each serving a specific purpose. Here is a brief overview of the pin configuration:

• Pins 1-10: Power supply and ground pins
• Pins 11-20: General-purpose I/O (GPIO) pins
• Pins 21-30: UART interface pins
• Pins 31-40: SPI interface pins
• Pins 41-50: I2C interface pins
• Pins 51-60: Timer/Counter pins
• Pins 61-70: Analog-to-Digital Converter (ADC) pins
• Pins 71-80: Pulse Width Modulation (PWM) pins
• Pins 81-90: External interrupt pins
• Pins 91-100: Miscellaneous control and communication pins

For a detailed pinout diagram and more information, refer to the LM3S2412-IQC25-A2 datasheet.

Functional Features

The LM3S2412-IQC25-A2 offers several functional features that make it suitable for a wide range of applications:

1. High-performance Processing: The ARM Cortex-M3 core provides efficient processing capabilities, enabling fast execution of complex tasks.
2. Integrated Peripherals: The microcontroller includes various peripherals such as UART, SPI, I2C, GPIO, timers, ADC, and PWM, allowing seamless integration with external devices.
3. Low Power Consumption: The LM3S2412-IQC25-A2 is designed to minimize power consumption, making it ideal for battery-powered applications.
4. Flexible Memory Options: With 128 KB of flash memory and 8 KB of RAM, the microcontroller can store program code and data efficiently.
5. Small Form Factor: The compact size of the QFP package enables the microcontroller's use in space-constrained designs.

Advantages and Disadvantages

Advantages: - High-performance ARM Cortex-M3 core for efficient processing - Integrated peripherals simplify system design and reduce external component count - Low power consumption extends battery life in portable applications - Ample flash memory and RAM for storing program code and data - Small form factor allows for use in compact designs

Disadvantages: - Limited number of I/O pins may restrict connectivity options in complex systems - Lack of built-in wireless communication capabilities may require additional components for wireless connectivity

Working Principles

The LM3S2412-IQC25-A2 operates based on the principles of a microcontroller. It executes instructions stored in its flash memory, processes data, and controls various peripherals to perform specific tasks. The ARM Cortex-M3 core provides the computational power required for these operations.

The microcontroller communicates with external devices through its integrated peripherals such as UART, SPI, I2C, and GPIO. It can read sensor data, control actuators, and exchange information with other devices or systems.

Detailed Application Field Plans