ES1GL M2G

Product Overview

Belongs to: Semiconductor Diodes
Category: Rectifier Diode
Use: ES1GL M2G is used as a rectifier in electronic circuits to convert alternating current (AC) to direct current (DC).
Characteristics: Fast switching, low leakage current, high surge capability.
Package: SMA (DO-214AC)
Essence: Silicon epitaxial planar diode
Packaging/Quantity: Tape & Reel, 3000 pieces per reel

Specifications

Voltage - Forward (Vf) (Max): 1.0V
Current - Average Rectified (Io): 1A
Voltage - DC Reverse (Vr) (Max): 400V
Reverse Recovery Time (trr): 35ns
Operating Temperature: -65°C ~ 150°C

Detailed Pin Configuration

The ES1GL M2G has two pins: 1. Anode (A) 2. Cathode (K)

Functional Features

Fast reverse recovery time
Low forward voltage drop
High reliability and ruggedness
Lead-free and RoHS compliant

Advantages and Disadvantages

Advantages: - Fast switching speed - Low power loss - High efficiency

Disadvantages: - Limited maximum current rating - Sensitive to temperature variations

Working Principles

ES1GL M2G operates based on the principle of rectification, where it allows current to flow in only one direction, effectively converting AC to DC.

Detailed Application Field Plans

ES1GL M2G is commonly used in the following applications: - Power supplies - LED lighting - Battery chargers - Switching power supplies - Consumer electronics

Detailed and Complete Alternative Models

Some alternative models to ES1GL M2G include: - 1N4001 - 1N5408 - FR107 - UF4007

This information provides a comprehensive overview of the ES1GL M2G rectifier diode, including its specifications, functional features, application field plans, and alternative models.

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací ES1GL M2G v technických řešeních

What is ES1GL M2G?
- ES1GL M2G is a type of epoxy resin adhesive commonly used in technical solutions for bonding, sealing, and encapsulating electronic components.
What are the key properties of ES1GL M2G?
- ES1GL M2G exhibits high thermal conductivity, excellent adhesion to various substrates, low shrinkage, and good electrical insulation properties.
How is ES1GL M2G applied in electronic assemblies?
- ES1GL M2G is typically dispensed or applied using automated dispensing equipment to bond and seal electronic components such as semiconductors, sensors, and connectors.
Can ES1GL M2G be used for potting applications?
- Yes, ES1GL M2G is suitable for potting applications to protect sensitive electronic components from environmental factors such as moisture, dust, and vibration.
What curing methods are compatible with ES1GL M2G?
- ES1GL M2G can be cured at room temperature or with heat, depending on the specific requirements of the application.
Is ES1GL M2G resistant to chemicals and solvents?
- Yes, ES1GL M2G demonstrates good resistance to a wide range of chemicals and solvents, making it suitable for demanding industrial environments.
Does ES1GL M2G comply with industry standards for electronics manufacturing?
- ES1GL M2G is formulated to meet industry standards for electronics manufacturing, including RoHS compliance and flame retardancy.
What are the recommended storage conditions for ES1GL M2G?
- ES1GL M2G should be stored in a cool, dry place away from direct sunlight and sources of heat to maintain its shelf life and performance.
Can ES1GL M2G be reworked or removed from electronic assemblies?
- While ES1GL M2G offers strong adhesion, it can be reworked or removed using appropriate solvents and mechanical methods if necessary.
Are there any safety considerations when handling ES1GL M2G?
- Users should follow standard safety practices when handling ES1GL M2G, including wearing appropriate personal protective equipment and ensuring adequate ventilation during application.