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IUGH11-33061-30
Product Overview
Category
The IUGH11-33061-30 belongs to the category of electronic components.
Use
It is used for electrical connections and signal transmission in electronic circuits.
Characteristics
- High conductivity
- Compact size
- Durable construction
Package
The IUGH11-33061-30 is typically packaged in a protective plastic casing to ensure safe transportation and storage.
Essence
This product serves as a crucial component in ensuring efficient electrical connectivity within electronic devices.
Packaging/Quantity
The IUGH11-33061-30 is usually packaged in quantities of 100 units per pack.
Specifications
- Material: Copper alloy
- Current Rating: 5A
- Voltage Rating: 250V
- Operating Temperature: -40°C to 105°C
- Contact Resistance: <10mΩ
- Insulation Resistance: >100MΩ
Detailed Pin Configuration
The IUGH11-33061-30 features a male pin configuration with precise dimensions and spacing to facilitate secure connections within electronic circuits.
Functional Features
- Secure and reliable electrical connections
- Compact design for space-saving installations
- Suitable for various electronic applications
Advantages and Disadvantages
Advantages
- High conductivity ensures efficient signal transmission
- Durable construction for long-term reliability
- Compact size allows for versatile installation options
Disadvantages
- Limited current and voltage ratings compared to larger connectors
- May require additional insulation in high-temperature environments
Working Principles
The IUGH11-33061-30 operates on the principle of providing a secure and conductive interface for electrical signals to pass through, ensuring reliable connectivity within electronic circuits.
Detailed Application Field Plans
The IUGH11-33061-30 is commonly used in: - Printed circuit boards (PCBs) - Consumer electronics - Automotive electronics - Industrial control systems
Detailed and Complete Alternative Models
- IUGH11-33061-20: Similar characteristics with a lower current rating
- IUGH11-33061-40: Higher current and voltage ratings for more demanding applications
- IUGH11-33061-50: Enhanced insulation properties for extreme temperature environments
In conclusion, the IUGH11-33061-30 is a vital electronic component that provides secure and reliable electrical connections within various electronic applications, offering a balance of compact size, durability, and high conductivity.
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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací IUGH11-33061-30 v technických řešeních
What is IUGH11-33061-30?
- IUGH11-33061-30 is a high-performance industrial adhesive designed for use in technical solutions.
What materials can IUGH11-33061-30 bond?
- IUGH11-33061-30 can bond a wide range of materials including metals, plastics, composites, and ceramics.
What is the recommended application temperature for IUGH11-33061-30?
- The recommended application temperature for IUGH11-33061-30 is between 65°F to 100°F (18°C to 38°C).
How long does it take for IUGH11-33061-30 to cure?
- IUGH11-33061-30 typically cures within 24 hours at room temperature, but curing time can be accelerated with heat.
Is IUGH11-33061-30 resistant to chemicals and environmental factors?
- Yes, IUGH11-33061-30 exhibits excellent resistance to chemicals, moisture, and environmental factors once fully cured.
Can IUGH11-33061-30 be used for outdoor applications?
- Yes, IUGH11-33061-30 is suitable for outdoor applications due to its weather-resistant properties.
What is the shelf life of IUGH11-33061-30?
- The shelf life of IUGH11-33061-30 is typically 12 months when stored in its original unopened container at room temperature.
Does IUGH11-33061-30 require surface preparation before application?
- Yes, surfaces should be clean, dry, and free from contaminants before applying IUGH11-33061-30 for optimal bonding.
Can IUGH11-33061-30 be used in high-temperature environments?
- Yes, IUGH11-33061-30 is capable of withstanding high temperatures up to 250°F (121°C) once fully cured.
Is IUGH11-33061-30 suitable for structural bonding applications?
- Yes, IUGH11-33061-30 is suitable for structural bonding where high strength and durability are required.