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BR25G256F-3GE2

BR25G256F-3GE2

Product Overview

Category

The BR25G256F-3GE2 belongs to the category of non-volatile memory devices.

Use

This product is primarily used for data storage and retrieval in various electronic devices.

Characteristics

  • Non-volatile: The BR25G256F-3GE2 retains stored data even when power is removed.
  • High capacity: It offers a storage capacity of 256 gigabits.
  • Fast access time: The device provides quick access to stored data.
  • Low power consumption: It operates efficiently with minimal power requirements.

Package

The BR25G256F-3GE2 is available in a compact package, suitable for integration into small electronic devices.

Essence

The essence of this product lies in its ability to store and retrieve large amounts of data reliably and efficiently.

Packaging/Quantity

The BR25G256F-3GE2 is typically packaged individually and is available in various quantities depending on customer requirements.

Specifications

  • Storage Capacity: 256 gigabits
  • Interface: SPI (Serial Peripheral Interface)
  • Operating Voltage: 2.7V - 3.6V
  • Operating Temperature Range: -40°C to +85°C
  • Data Retention: Up to 10 years
  • Write Endurance: 1 million cycles

Detailed Pin Configuration

The BR25G256F-3GE2 features the following pin configuration:

  1. VCC: Power supply voltage
  2. GND: Ground
  3. CS: Chip select
  4. SCK: Serial clock input
  5. SI: Serial data input
  6. SO: Serial data output
  7. WP: Write protect
  8. HOLD: Hold input

Functional Features

  • High-speed data transfer: The BR25G256F-3GE2 supports fast data transfer rates, enabling efficient read and write operations.
  • Flexible addressing: The device allows for flexible addressing schemes, facilitating easy access to specific memory locations.
  • Write protection: The WP pin can be used to protect the stored data from accidental modification.
  • Low power consumption: The product is designed to operate with minimal power consumption, making it suitable for battery-powered devices.

Advantages and Disadvantages

Advantages

  • Large storage capacity
  • Fast access time
  • Non-volatile memory
  • Low power consumption

Disadvantages

  • Limited compatibility with certain interfaces
  • Relatively high cost compared to other memory options

Working Principles

The BR25G256F-3GE2 utilizes flash memory technology to store and retrieve data. It employs a serial peripheral interface (SPI) for communication with the host device. The device operates by sending commands and data through the SPI interface, allowing for efficient read and write operations.

Detailed Application Field Plans

The BR25G256F-3GE2 finds applications in various electronic devices, including but not limited to: - Consumer electronics - Automotive systems - Industrial equipment - Medical devices - Communication devices

Detailed and Complete Alternative Models

  1. BR25G128F-3GE2: A similar non-volatile memory device with a storage capacity of 128 gigabits.
  2. BR25G512F-3GE2: An alternative model offering a higher storage capacity of 512 gigabits.
  3. BR25G256F-3AE2: A variant with extended temperature range (-40°C to +105°C) for more demanding environments.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací BR25G256F-3GE2 v technických řešeních

Sure! Here are 10 common questions and answers related to the application of BR25G256F-3GE2 in technical solutions:

1. What is the BR25G256F-3GE2? - The BR25G256F-3GE2 is a specific model of a serial EEPROM (Electrically Erasable Programmable Read-Only Memory) manufactured by a company called ROHM Semiconductor.

2. What is the storage capacity of the BR25G256F-3GE2? - The BR25G256F-3GE2 has a storage capacity of 256 kilobits, which is equivalent to 32 kilobytes.

3. What are some typical applications for the BR25G256F-3GE2? - The BR25G256F-3GE2 is commonly used in various technical solutions such as automotive systems, industrial equipment, consumer electronics, and communication devices.

4. How does the BR25G256F-3GE2 connect to other components in a system? - The BR25G256F-3GE2 uses a standard SPI (Serial Peripheral Interface) protocol to communicate with other microcontrollers or devices in a system.

5. Can the BR25G256F-3GE2 be easily integrated into existing designs? - Yes, the BR25G256F-3GE2 is designed to be compatible with industry-standard EEPROMs, making it relatively easy to integrate into existing designs.

6. What is the operating voltage range of the BR25G256F-3GE2? - The BR25G256F-3GE2 operates within a voltage range of 1.7V to 5.5V, allowing it to be used in a wide variety of systems.

7. Does the BR25G256F-3GE2 support high-speed data transfer? - Yes, the BR25G256F-3GE2 supports a maximum clock frequency of 10 MHz, enabling fast data transfer rates.

8. Can the BR25G256F-3GE2 retain data during power loss? - Yes, the BR25G256F-3GE2 has built-in non-volatile memory, which means it can retain data even when power is disconnected.

9. Is the BR25G256F-3GE2 resistant to environmental factors? - Yes, the BR25G256F-3GE2 is designed to be resistant to various environmental factors such as temperature, humidity, and electromagnetic interference.

10. Are there any specific programming requirements for the BR25G256F-3GE2? - The BR25G256F-3GE2 can be programmed using standard SPI commands, and ROHM Semiconductor provides documentation and software tools to facilitate programming and configuration.