MC9S12DG128CPVER

Product Overview

• Category: Microcontroller
• Use: Embedded systems, automotive applications
• Characteristics: 16-bit architecture, high-performance, low-power consumption
• Package: 112-pin LQFP (Low Profile Quad Flat Package)
• Essence: A microcontroller designed for automotive applications with a focus on performance and power efficiency.
• Packaging/Quantity: Available in tape and reel packaging, quantity varies based on customer requirements.

Specifications

• Architecture: 16-bit
• CPU Speed: Up to 25 MHz
• Flash Memory: 128 KB
• RAM: 4 KB
• Operating Voltage: 2.35V to 5.5V
• I/O Pins: 84
• Timers: 8-bit and 16-bit timers available
• Communication Interfaces: SPI, SCI, CAN, I2C
• Analog-to-Digital Converter (ADC): 10-bit resolution, up to 16 channels

Detailed Pin Configuration

The MC9S12DG128CPVER has a total of 112 pins. The pin configuration is as follows:

• Pins 1-4: VDD (Power Supply)
• Pins 5-8: Ground
• Pins 9-16: Port A (General Purpose I/O)
• Pins 17-24: Port B (General Purpose I/O)
• Pins 25-32: Port C (General Purpose I/O)
• Pins 33-40: Port D (General Purpose I/O)
• Pins 41-48: Port E (General Purpose I/O)
• Pins 49-56: Port F (General Purpose I/O)
• Pins 57-64: Port G (General Purpose I/O)
• Pins 65-72: Port H (General Purpose I/O)
• Pins 73-80: Port J (General Purpose I/O)
• Pins 81-88: Port K (General Purpose I/O)
• Pins 89-96: Analog Inputs
• Pins 97-104: Communication Interfaces (SPI, SCI, CAN, I2C)
• Pins 105-112: Timers and Other Control Signals

Functional Features

• High-performance 16-bit architecture for efficient processing of complex tasks.
• Low-power consumption, making it suitable for battery-powered applications.
• Extensive range of communication interfaces (SPI, SCI, CAN, I2C) for seamless integration with other devices.
• Flexible I/O pins for interfacing with external components.
• On-chip analog-to-digital converter for precise measurement of analog signals.
• Multiple timers for accurate timing and event management.

Advantages and Disadvantages

Advantages: - High-performance architecture enables efficient execution of complex tasks. - Low-power consumption extends battery life in portable applications. - Wide range of communication interfaces allows for easy integration with other devices. - Ample I/O pins provide flexibility in connecting external components. - On-chip analog-to-digital converter simplifies analog signal measurement. - Multiple timers facilitate precise timing and event management.

Disadvantages: - Limited flash memory capacity compared to some other microcontrollers in the market. - Higher cost compared to lower-end microcontrollers with similar specifications.

Working Principles

The MC9S12DG128CPVER operates based on a 16-bit architecture. It executes instructions stored in its flash memory, which can be programmed by the user. The microcontroller communicates with external devices through its various communication interfaces such as SPI, SCI, CAN, and I2C. It also has multiple I/O pins that can be configured as inputs or outputs to interface with external components. The on-chip analog-to-digital converter allows for precise measurement of analog signals. The microcontroller's timers enable accurate timing and event management.

Detailed Application Field Plans

The MC9S12DG128CPVER is primarily designed for automotive applications. It can be used in various automotive systems such as engine control units, body control modules, and instrument clusters. Its high-performance architecture and extensive communication interfaces make it suitable for handling complex tasks in automotive electronics. The low-power consumption of the microcontroller ensures efficient operation in battery-powered automotive applications.

Detailed and Complete Alternative Models

• MC9S12DJ128CPVE: Similar to MC9S12DG128CPVER but with a different package (80-pin LQFP).
• MC9S12DG256CPVE: Higher flash memory capacity (256 KB) compared to MC9S12DG128CPVER.
• MC9S12DT256CPVE: Similar to MC9S12DG256CPVE but with additional EEPROM memory.

These alternative models offer different packaging options and varying memory capacities to cater to different application requirements.