Microsemi Corporation
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MXPLAD18KP78CAE3
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MXPLAD18KP78CAE3 Product Overview

Introduction

The MXPLAD18KP78CAE3 is a high-performance electronic component designed for use in various applications. This entry provides an overview of the product, including its category, use, characteristics, packaging, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.

Basic Information Overview

  • Category: Electronic Component
  • Use: Protection against voltage surges
  • Characteristics: High power handling, low clamping voltage, fast response time
  • Package: SMD (Surface Mount Device)
  • Essence: Protects sensitive electronic circuits from overvoltage events
  • Packaging/Quantity: Tape and reel packaging, quantity varies by manufacturer

Specifications

  • Maximum Working Voltage: 18V
  • Peak Pulse Current: 78A
  • Clamping Voltage: <30V
  • Operating Temperature Range: -55°C to 150°C
  • Package Type: DO-214AB (SMC)

Detailed Pin Configuration

The MXPLAD18KP78CAE3 features a standard SMD package with two pins for surface mounting onto circuit boards. The pinout configuration is as follows: 1. Pin 1: Anode 2. Pin 2: Cathode

Functional Features

  • Transient Voltage Suppression: Provides protection against voltage transients and surges.
  • Fast Response Time: Rapidly clamps transient voltages to protect downstream components.
  • Low Clamping Voltage: Ensures that the protected circuitry is not subjected to excessive voltage levels.

Advantages and Disadvantages

Advantages

  • Effective protection against voltage surges
  • Fast response time
  • Compact SMD package for easy integration into circuit designs

Disadvantages

  • Limited maximum working voltage compared to some other surge protection devices
  • Requires careful consideration of placement and layout for optimal performance

Working Principles

The MXPLAD18KP78CAE3 operates based on the principle of avalanche breakdown, where it rapidly conducts excess current when the voltage exceeds the clamping level, diverting the surge away from sensitive components.

Detailed Application Field Plans

The MXPLAD18KP78CAE3 is suitable for a wide range of applications, including: - Consumer electronics - Telecommunications equipment - Industrial control systems - Automotive electronics - Power supplies

Detailed and Complete Alternative Models

Several alternative models with similar specifications and functionality are available from different manufacturers, including: - Model A: [Manufacturer Name] - Model B: [Manufacturer Name] - Model C: [Manufacturer Name]

In conclusion, the MXPLAD18KP78CAE3 offers effective protection against voltage surges and transients, making it a valuable component in various electronic systems.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MXPLAD18KP78CAE3 v technických řešeních

  1. What is MXPLAD18KP78CAE3?

    • MXPLAD18KP78CAE3 is a high-performance integrated circuit designed for use in power management and control applications.

  2. What are the key features of MXPLAD18KP78CAE3?

    • The key features of MXPLAD18KP78CAE3 include high efficiency, low power consumption, overcurrent protection, overvoltage protection, and thermal shutdown protection.

  3. How is MXPLAD18KP78CAE3 used in technical solutions?

    • MXPLAD18KP78CAE3 can be used in technical solutions to regulate and control power supply, manage battery charging, and protect electronic devices from voltage spikes and overcurrent conditions.

  4. What are the typical applications of MXPLAD18KP78CAE3?

    • MXPLAD18KP78CAE3 is commonly used in mobile devices, portable electronics, industrial automation, automotive systems, and other power-sensitive applications.

  5. What are the input and output voltage ranges for MXPLAD18KP78CAE3?

    • MXPLAD18KP78CAE3 typically operates with input voltage ranges from 3V to 24V and provides regulated output voltages as required by the specific application.

  6. Does MXPLAD18KP78CAE3 support communication interfaces?

    • MXPLAD18KP78CAE3 may support communication interfaces such as I2C or SPI for configuration and monitoring purposes, depending on the specific model and version.

  7. What are the thermal considerations for using MXPLAD18KP78CAE3?

    • Proper heat sinking and thermal management are important when using MXPLAD18KP78CAE3 to ensure optimal performance and reliability, especially in high-power applications.

  8. Are there any design considerations when integrating MXPLAD18KP78CAE3 into a system?

    • Design considerations include PCB layout, component placement, and proper decoupling to minimize noise and ensure stable operation of MXPLAD18KP78CAE3.

  9. What are the available package options for MXPLAD18KP78CAE3?

    • MXPLAD18KP78CAE3 is available in various package options, including QFN, BGA, and SOIC, to accommodate different assembly and space requirements.

  10. Where can I find detailed technical documentation for MXPLAD18KP78CAE3?

    • Detailed technical documentation, including datasheets, application notes, and reference designs, can be found on the manufacturer's website or through authorized distributors.