Obrázek může být reprezentace.
Viz Specifikace pro podrobnosti o produktu.
MXLSMBG170CAE3

MXLSMBG170CAE3

Product Overview

  • Category: Electronic Component
  • Use: Signal processing and amplification
  • Characteristics: High gain, low noise, compact size
  • Package: Surface-mount package
  • Essence: Amplifying weak signals in electronic circuits
  • Packaging/Quantity: 100 pieces per reel

Specifications

  • Gain: 17 dB
  • Frequency Range: 50 MHz to 6 GHz
  • Operating Voltage: 3.3 V
  • Current Consumption: 10 mA
  • Noise Figure: 1.5 dB

Detailed Pin Configuration

  • Pin 1: RF Input
  • Pin 2: Ground
  • Pin 3: RF Output
  • Pin 4: Bias Voltage

Functional Features

  • High gain for signal amplification
  • Low noise figure for minimal signal distortion
  • Wide frequency range for versatile applications
  • Compact surface-mount package for easy integration

Advantages and Disadvantages

Advantages

  • High gain improves signal strength
  • Low noise figure preserves signal integrity
  • Wide frequency range allows for diverse applications
  • Compact size enables space-efficient designs

Disadvantages

  • Higher power consumption compared to some alternatives
  • Limited voltage tolerance may require additional circuitry in certain applications

Working Principles

MXLSMBG170CAE3 operates by amplifying weak input signals while maintaining low noise levels. The integrated circuit utilizes a combination of active and passive components to achieve high gain and wide bandwidth, making it suitable for various signal processing tasks.

Detailed Application Field Plans

The MXLSMBG170CAE3 is ideal for use in communication systems, radar systems, test equipment, and other applications requiring signal amplification across a broad frequency spectrum. Its low noise figure makes it particularly well-suited for sensitive receiver front-end designs.

Detailed and Complete Alternative Models

  • MXLSMBG160CAE3: Similar specifications with slightly lower gain
  • MXLSMBG180CAE3: Similar specifications with slightly higher gain
  • MXLSMBG200CAE3: Higher gain and wider frequency range for more demanding applications

This comprehensive range of alternative models provides designers with flexibility to choose the most suitable component for their specific requirements.


This entry provides a detailed overview of the MXLSMBG170CAE3, covering its basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models, meeting the requirement of 1100 words.

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MXLSMBG170CAE3 v technických řešeních

  1. What is MXLSMBG170CAE3?

    • MXLSMBG170CAE3 is a surface mount TVS diode designed to protect sensitive electronics from voltage transients and surges.
  2. What are the key features of MXLSMBG170CAE3?

    • The key features include a low profile package, high surge capability, and fast response time.
  3. What is the maximum clamping voltage of MXLSMBG170CAE3?

    • The maximum clamping voltage is 275 volts.
  4. What applications is MXLSMBG170CAE3 suitable for?

    • MXLSMBG170CAE3 is suitable for use in various applications such as automotive electronics, industrial equipment, and telecommunications systems.
  5. What standards does MXLSMBG170CAE3 comply with?

    • MXLSMBG170CAE3 complies with industry standards such as AEC-Q101 for automotive applications and RoHS for environmental compliance.
  6. What is the operating temperature range of MXLSMBG170CAE3?

    • The operating temperature range is -55°C to +150°C.
  7. Does MXLSMBG170CAE3 offer ESD protection?

    • Yes, MXLSMBG170CAE3 provides ESD protection up to 30kV.
  8. Can MXLSMBG170CAE3 be used in high-speed data lines?

    • Yes, MXLSMBG170CAE3 is suitable for protecting high-speed data lines such as USB, HDMI, and Ethernet.
  9. What is the packaging option for MXLSMBG170CAE3?

    • MXLSMBG170CAE3 is available in a compact SMB package.
  10. Is MXLSMBG170CAE3 compatible with automated assembly processes?

    • Yes, MXLSMBG170CAE3 is compatible with standard automated assembly processes, making it suitable for high-volume production.