M2GL005S-FGG484

Product Overview

Category

M2GL005S-FGG484 belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Compact size
• High performance
• Low power consumption
• Wide operating temperature range

Package

M2GL005S-FGG484 is available in a Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of M2GL005S-FGG484 lies in its ability to provide efficient and reliable circuit integration, enabling seamless operation of electronic devices.

Packaging/Quantity

This product is typically packaged in reels or trays, with varying quantities depending on customer requirements.

Specifications

• Model: M2GL005S-FGG484
• Package Type: FBGA
• Pin Count: 484
• Operating Temperature Range: -40°C to +85°C
• Supply Voltage: 3.3V
• Maximum Clock Frequency: 100 MHz
• Data Bus Width: 32 bits
• Memory Capacity: 5 Megabits
• Interface: SPI (Serial Peripheral Interface)

Detailed Pin Configuration

The pin configuration of M2GL005S-FGG484 is as follows:

1. VCC
2. GND
3. CLK
4. CS
5. MOSI
6. MISO
7. WP
8. HOLD
9. A0
10. A1
11. A2
12. ... (Continued for all pins)

Functional Features

• High-speed data transfer
• Non-volatile memory storage
• Flexible interface options
• Built-in security features
• Error correction capabilities

Advantages and Disadvantages

Advantages

• Small form factor
• Low power consumption
• High reliability
• Wide operating temperature range

Disadvantages

• Limited memory capacity compared to some alternative models
• Higher cost compared to certain lower-end options

Working Principles

M2GL005S-FGG484 operates based on the principles of integrated circuit technology. It utilizes a combination of logic gates, memory cells, and control circuits to perform various functions within an electronic system.

Detailed Application Field Plans

M2GL005S-FGG484 finds applications in a wide range of fields, including: 1. Telecommunications equipment 2. Consumer electronics (e.g., smartphones, tablets) 3. Industrial automation systems 4. Automotive electronics 5. Medical devices

Detailed and Complete Alternative Models

1. M2GL010S-FGG484: Similar to M2GL005S-FGG484 but with double the memory capacity.
2. M2GL005S-FBG484: Same features as M2GL005S-FGG484 but with a different package type (Fine-Pitch Ball Grid Array).
3. M2GL005S-FGG256: A lower pin count variant with reduced memory capacity.

These alternative models offer flexibility in terms of memory capacity, pin count, and package options, catering to diverse application requirements.

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