A54SX32-1BG313M

Product Overview

Category

The A54SX32-1BG313M belongs to the category of programmable logic devices (PLDs).

Use

This product is primarily used in digital circuit design and implementation. It provides a flexible and customizable solution for various applications.

Characteristics

• Programmable: The A54SX32-1BG313M can be programmed to perform specific functions based on user requirements.
• High-density: This device offers a high number of logic elements, allowing for complex designs.
• Low power consumption: The A54SX32-1BG313M is designed to operate efficiently with minimal power consumption.
• Fast operation: With its advanced architecture, this PLD ensures high-speed performance.

Package

The A54SX32-1BG313M comes in a compact package that is suitable for integration into electronic systems.

Essence

The essence of the A54SX32-1BG313M lies in its ability to provide reconfigurable logic functionality, enabling designers to implement custom digital circuits.

Packaging/Quantity

This product is typically packaged in trays or reels, depending on the quantity ordered. The exact packaging specifications may vary based on the supplier.

Specifications

• Logic Elements: 54,000
• Flip-Flops: 32,000
• Maximum Frequency: 250 MHz
• I/O Pins: 313
• Operating Voltage: 3.3V
• Package Type: Ball Grid Array (BGA)
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The A54SX32-1BG313M has a total of 313 pins, each serving a specific purpose in the device's operation. For a detailed pin configuration diagram, please refer to the manufacturer's datasheet.

Functional Features

• Reconfigurability: The A54SX32-1BG313M allows users to modify the logic functions and interconnections, providing flexibility in system design.
• High-Speed Performance: With a maximum operating frequency of 250 MHz, this PLD can handle demanding applications that require fast data processing.
• I/O Flexibility: The device offers a large number of I/O pins, enabling seamless integration with other components or external devices.
• Low Power Consumption: The A54SX32-1BG313M is designed to minimize power consumption, making it suitable for battery-powered applications.

Advantages and Disadvantages

Advantages

• Versatility: The reconfigurable nature of the A54SX32-1BG313M allows for a wide range of applications.
• High-Density Integration: With its large number of logic elements, complex designs can be implemented efficiently.
• Fast Prototyping: The programmable nature of this PLD enables rapid development and testing of digital circuits.

Disadvantages

• Learning Curve: Utilizing the full potential of the A54SX32-1BG313M may require a learning curve for designers unfamiliar with programmable logic devices.
• Cost: Compared to fixed-function integrated circuits, PLDs like the A54SX32-1BG313M can be relatively more expensive.

Working Principles

The A54SX32-1BG313M operates based on the principles of field-programmable gate arrays (FPGAs). It consists of configurable logic blocks (CLBs), interconnect resources, and I/O blocks. Users program the device using hardware description languages (HDLs) or specialized software tools, defining the desired logic functions and interconnections. Once programmed, the PLD executes the specified operations.

Detailed Application Field Plans

The A54SX32-1BG313M finds applications in various fields, including: 1. Telecommunications: Used in network equipment, routers, and switches for high-speed data processing. 2. Industrial Automation: Employed in control systems, robotics, and machine vision applications. 3. Automotive Electronics: Integrated into automotive control units, infotainment systems, and driver assistance systems. 4. Aerospace and Defense: Utilized in avionics, radar systems, and military-grade electronics.

Detailed and Complete Alternative Models

1. A54SX16-1FGG484M

   • Logic Elements: 16,000
   • Flip-Flops: 8,000
   • Maximum Frequency: 200 MHz
   • I/O Pins: 484
   • Operating Voltage: 3.3V
   • Package Type: Fine-Pitch Ball Grid Array (FBGA)

2. A54SX72-1FGG484M

   • Logic Elements: 72,000
   • Flip-Flops: 36,000
   • Maximum Frequency: 300 MHz
   • I/O Pins: 484
   • Operating Voltage: 3.3V
   • Package Type: Fine-Pitch Ball Grid Array (FBGA