A3PE3000L-FGG896

Product Overview

Category

The A3PE3000L-FGG896 belongs to the category of programmable logic devices (PLDs).

Use

This product is primarily used in digital circuit design and implementation. It provides a flexible and customizable solution for various applications.

Characteristics

• Programmable: The A3PE3000L-FGG896 can be programmed to perform specific functions according to the requirements of the application.
• High-density: This PLD offers a high number of logic elements, allowing for complex designs.
• Low power consumption: The device is designed to operate efficiently with minimal power consumption.
• Fast operation: The A3PE3000L-FGG896 offers high-speed performance, enabling rapid data processing.

Package

The A3PE3000L-FGG896 comes in a Fine-Pitch Ball Grid Array (FBGA) package, which ensures reliable electrical connections and compact form factor.

Essence

The essence of this product lies in its ability to provide reconfigurable logic functionality, allowing designers to implement custom digital circuits without the need for dedicated hardware.

Packaging/Quantity

The A3PE3000L-FGG896 is typically packaged individually and is available in various quantities depending on the manufacturer's specifications.

Specifications

• Logic Elements: 3,000
• Flip-Flops: 1,536
• Block RAM: 432 Kbits
• Maximum Frequency: 400 MHz
• I/O Pins: 896
• Operating Voltage: 1.2V
• Package Type: FBGA
• Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The A3PE3000L-FGG896 has a total of 896 I/O pins, each serving a specific purpose in the circuit design. The pin configuration details can be found in the product datasheet provided by the manufacturer.

Functional Features

• Reconfigurable Logic: The A3PE3000L-FGG896 allows users to modify the logic functions and interconnections within the device, providing flexibility in circuit design.
• High-Speed Performance: With a maximum operating frequency of 400 MHz, this PLD can handle demanding applications that require fast data processing.
• On-Chip Memory: The built-in block RAM provides ample storage for data manipulation and temporary storage during operation.
• I/O Flexibility: The large number of I/O pins enables seamless integration with external devices and peripherals.

Advantages and Disadvantages

Advantages

• Flexibility: The reconfigurable nature of the A3PE3000L-FGG896 allows for quick prototyping and design iterations.
• Cost-Effective: By eliminating the need for dedicated hardware, this PLD reduces overall development costs.
• High-Density Integration: The device offers a high number of logic elements, enabling complex designs in a compact form factor.

Disadvantages

• Steep Learning Curve: Utilizing the full potential of this PLD requires expertise in digital circuit design and programming.
• Limited Resources: Despite its high-density integration, the A3PE3000L-FGG896 may have limitations in terms of available logic elements and memory compared to other advanced PLDs.

Working Principles

The A3PE3000L-FGG896 operates based on the principles of field-programmable gate arrays (FPGAs). It consists of configurable logic blocks interconnected through programmable routing resources. These blocks can be programmed to implement specific logic functions, allowing for the creation of custom digital circuits.

Detailed Application Field Plans

The A3PE3000L-FGG896 finds applications in various fields, including:

1. Communications: Used in networking equipment, routers, and switches for efficient data processing and protocol handling.
2. Industrial Automation: Employed in control systems, robotics, and machine vision applications for real-time data processing and control.
3. Automotive Electronics: Integrated into automotive control units for functions such as engine management, safety systems, and infotainment.
4. Aerospace and Defense: Utilized in avionics systems, radar signal processing, and secure communication systems.

Detailed and Complete Alternative Models

1. A3P1000-1FGG144: A lower-density alternative with 1,000 logic elements and 144 I/O pins.
2. A3P600L-FGG256: A mid-range option with 600 logic elements and 256 I/O pins.
3. A3P030-1FGG144: A cost-effective choice with 30 logic elements and 144 I/O pins.

These alternative models offer varying levels of logic density and I/O capabilities to cater to different design requirements.

In conclusion, the A3PE3000L-FGG896 is a programmable logic device that provides flexibility, high-density integration, and fast performance. Its reconfigurable nature makes it suitable for a wide range of applications in