Micron Technology Inc.
Obrázek může být reprezentace.
Viz Specifikace pro podrobnosti o produktu.
MT53B256M32D1NP-062 AAT:C

MT53B256M32D1NP-062 AAT:C

Basic Information Overview

Category: Memory Chip
Use: Data storage and retrieval
Characteristics: High capacity, fast data transfer rate
Package: Integrated circuit (IC)
Essence: Non-volatile memory technology
Packaging/Quantity: Individual chip

Specifications

  • Model: MT53B256M32D1NP-062 AAT:C
  • Capacity: 256 megabits (32 megabytes)
  • Organization: 256M x 32 bits
  • Interface: Parallel
  • Voltage Supply: 3.3V
  • Operating Temperature Range: -40°C to +85°C
  • Speed: Up to 166 MHz
  • Package Type: 90-ball FBGA (Fine-pitch Ball Grid Array)

Detailed Pin Configuration

The MT53B256M32D1NP-062 AAT:C memory chip has a total of 90 pins. The pin configuration is as follows:

  1. VDD
  2. VDDQ
  3. DQ0
  4. DQ1
  5. DQ2
  6. DQ3
  7. DQ4
  8. DQ5
  9. DQ6
  10. DQ7
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. DQ16
  20. DQ17
  21. DQ18
  22. DQ19
  23. DQ20
  24. DQ21
  25. DQ22
  26. DQ23
  27. DQ24
  28. DQ25
  29. DQ26
  30. DQ27
  31. DQ28
  32. DQ29
  33. DQ30
  34. DQ31
  35. A0
  36. A1
  37. A2
  38. A3
  39. A4
  40. A5
  41. A6
  42. A7
  43. A8
  44. A9
  45. A10
  46. A11
  47. A12
  48. A13
  49. A14
  50. A15
  51. A16
  52. A17
  53. A18
  54. A19
  55. A20
  56. A21
  57. A22
  58. A23
  59. A24
  60. A25
  61. A26
  62. A27
  63. A28
  64. A29
  65. A30
  66. A31
  67. /WE (Write Enable)
  68. /OE (Output Enable)
  69. /CE (Chip Enable)
  70. CKE (Clock Enable)
  71. /RAS (Row Address Strobe)
  72. /CAS (Column Address Strobe)
  73. /CS (Chip Select)
  74. BA0 (Bank Address 0)
  75. BA1 (Bank Address 1)
  76. VSS
  77. VSSQ
  78. NC (No Connection)
  79. NC (No Connection)
  80. NC (No Connection)
  81. NC (No Connection)
  82. NC (No Connection)
  83. NC (No Connection)
  84. NC (No Connection)
  85. NC (No Connection)
  86. NC (No Connection)
  87. NC (No Connection)
  88. NC (No Connection)
  89. NC (No Connection)
  90. VREF

Functional Features

  • High-speed data transfer with a maximum frequency of 166 MHz
  • Non-volatile memory technology ensures data retention even when power is lost
  • Low power consumption for energy-efficient operation
  • Wide operating temperature range (-40°C to +85°C) for versatile applications
  • Easy integration with parallel interface compatibility

Advantages and Disadvantages

Advantages: - High capacity allows for storing large amounts of data - Fast data transfer rate enables quick access to stored information - Non-volatile memory ensures data integrity during power interruptions - Versatile operating temperature range suits various environments - Compact package size facilitates space-saving designs

Disadvantages: - Limited compatibility with systems that only support serial interfaces - Higher power consumption compared to some other memory technologies - Relatively higher cost per unit compared to lower capacity memory chips

Working Principles

The MT53B256M32D1NP-062 AAT:C memory chip utilizes non-volatile memory technology to store and retrieve data. It operates based on the principles of parallel data transfer, where data is transmitted simultaneously across multiple data lines. The chip communicates with the host system through various control signals such as write enable

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT53B256M32D1NP-062 AAT:C v technických řešeních

  1. What is the MT53B256M32D1NP-062 AAT:C?

    • The MT53B256M32D1NP-062 AAT:C is a specific model of memory chip manufactured by Micron Technology. It is commonly used in technical solutions that require high-performance and reliable memory storage.

  2. What is the capacity of the MT53B256M32D1NP-062 AAT:C?

    • The MT53B256M32D1NP-062 AAT:C has a capacity of 256 megabits (32 megabytes). This means it can store a significant amount of data for various applications.

  3. What are the key features of the MT53B256M32D1NP-062 AAT:C?

    • Some key features of the MT53B256M32D1NP-062 AAT:C include low power consumption, high-speed operation, wide temperature range (-40°C to +85°C), and compatibility with various interfaces such as DDR3L and LPDDR3.

  4. In what type of technical solutions can the MT53B256M32D1NP-062 AAT:C be used?

    • The MT53B256M32D1NP-062 AAT:C can be used in a wide range of technical solutions, including but not limited to mobile devices, automotive electronics, industrial applications, networking equipment, and embedded systems.

  5. What is the operating voltage of the MT53B256M32D1NP-062 AAT:C?

    • The MT53B256M32D1NP-062 AAT:C operates at a voltage of 1.35V (DDR3L) or 1.2V (LPDDR3), depending on the specific interface used.

  6. What is the maximum clock frequency supported by the MT53B256M32D1NP-062 AAT:C?

    • The MT53B256M32D1NP-062 AAT:C supports a maximum clock frequency of 800 MHz (DDR3L) or 1066 MHz (LPDDR3), depending on the specific interface used.

  7. Does the MT53B256M32D1NP-062 AAT:C support ECC (Error Correction Code)?

    • No, the MT53B256M32D1NP-062 AAT:C does not support ECC. It is a non-ECC memory chip.

  8. What is the package type of the MT53B256M32D1NP-062 AAT:C?

    • The MT53B256M32D1NP-062 AAT:C is available in a BGA (Ball Grid Array) package, which is commonly used for surface-mounting integrated circuits.

  9. Is the MT53B256M32D1NP-062 AAT:C RoHS compliant?

    • Yes, the MT53B256M32D1NP-062 AAT:C is RoHS (Restriction of Hazardous Substances) compliant, meaning it meets the environmental standards set by the European Union.

  10. Where can I find more detailed technical information about the MT53B256M32D1NP-062 AAT:C?

    • You can refer to the datasheet provided by Micron Technology for comprehensive technical information about the MT53B256M32D1NP-062 AAT:C. It contains detailed specifications, electrical characteristics, and application guidelines.