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MT29F4T08CTHBBM5-3C:B

MT29F4T08CTHBBM5-3C:B

Basic Information Overview

  • Category: Memory Device
  • Use: Data storage and retrieval
  • Characteristics:
    • Non-volatile memory
    • High capacity
    • Fast read/write speeds
  • Package: BGA (Ball Grid Array)
  • Essence: Flash memory chip
  • Packaging/Quantity: Single chip in a package

Specifications

  • Model: MT29F4T08CTHBBM5-3C:B
  • Memory Type: NAND Flash
  • Capacity: 4GB
  • Organization: 8 bits x 4,096 pages x 2,112 blocks
  • Interface: Toggle Mode 2.0
  • Voltage Supply: 2.7V - 3.6V
  • Operating Temperature: -40°C to +85°C
  • Endurance: 3,000 Program/Erase cycles
  • Data Retention: 10 years

Detailed Pin Configuration

The MT29F4T08CTHBBM5-3C:B has a total of 48 pins. The pin configuration is as follows:

  1. VCCQ
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. WE#
  11. RE#
  12. CLE
  13. ALE
  14. CE#
  15. R/B#
  16. WP#
  17. VSSQ
  18. NC
  19. NC
  20. NC
  21. NC
  22. NC
  23. NC
  24. NC
  25. NC
  26. NC
  27. NC
  28. NC
  29. NC
  30. NC
  31. NC
  32. NC
  33. NC
  34. NC
  35. NC
  36. NC
  37. NC
  38. NC
  39. NC
  40. NC
  41. NC
  42. NC
  43. NC
  44. NC
  45. NC
  46. NC
  47. NC
  48. VCC

Functional Features

  • Toggle Mode 2.0 interface for high-speed data transfer
  • Error Correction Code (ECC) for data integrity
  • Block Management for efficient memory utilization
  • Wear-Leveling algorithm to evenly distribute write/erase cycles
  • Bad Block Management for reliable operation

Advantages and Disadvantages

Advantages: - High capacity for storing large amounts of data - Fast read/write speeds for quick data access - Non-volatile memory retains data even without power - Toggle Mode 2.0 interface enables high-speed data transfer

Disadvantages: - Limited endurance with a maximum of 3,000 Program/Erase cycles - Relatively higher cost compared to other memory technologies

Working Principles

The MT29F4T08CTHBBM5-3C:B is based on NAND flash memory technology. It stores data in a series of memory cells organized in pages and blocks. When data needs to be written, the memory controller sends the appropriate signals to the chip's pins, specifying the target address and data to be stored. The chip then performs the necessary operations to program the data into the memory cells. Similarly, when data needs to be read, the chip retrieves the requested data from the memory cells and sends it back to the memory controller.

Detailed Application Field Plans

The MT29F4T08CTHBBM5-3C:B is widely used in various electronic devices that require non-volatile data storage, such as: - Solid-State Drives (SSDs) - USB Flash Drives - Digital Cameras - Mobile Phones - Tablets - Industrial Control Systems

Detailed and Complete Alternative Models

  1. MT29F4G08ABAEAWP-IT:E - 4GB NAND Flash Memory, TSOP package
  2. S34ML04G200TFI000 - 4GB NAND Flash Memory, BGA package
  3. H27U4G8F2ETR-BC - 4GB NAND Flash Memory, TSOP package
  4. IS43TR16512AL-125KBLI - 4GB DDR3 SDRAM, BGA package
  5. MX25L4006EZNI-12G - 4MB NOR Flash Memory, SOP package

These alternative models offer similar storage capacities and functionalities to the MT29F4T08CTHBBM5-3C:B, but may differ in terms of package type, interface, or specific features.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT29F4T08CTHBBM5-3C:B v technických řešeních

  1. Question: What is the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B is a specific model of NAND flash memory chip manufactured by Micron Technology.

  2. Question: What is the capacity of the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B has a capacity of 4 gigabytes (GB).

  3. Question: What is the interface used by the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B uses a standard NAND flash interface.

  4. Question: What are some common applications for the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B is commonly used in various technical solutions such as embedded systems, solid-state drives (SSDs), industrial automation, and automotive electronics.

  5. Question: What is the operating voltage range of the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B operates within a voltage range of 2.7V to 3.6V.

  6. Question: What is the maximum data transfer rate of the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B supports a maximum data transfer rate of up to 200 megabytes per second (MB/s).

  7. Question: Does the MT29F4T08CTHBBM5-3C:B support error correction codes (ECC)?
    Answer: Yes, the MT29F4T08CTHBBM5-3C:B supports built-in hardware ECC to ensure data integrity.

  8. Question: Can the MT29F4T08CTHBBM5-3C:B withstand extreme temperatures?
    Answer: Yes, the MT29F4T08CTHBBM5-3C:B is designed to operate reliably in a wide temperature range, typically from -40°C to 85°C.

  9. Question: Is the MT29F4T08CTHBBM5-3C:B compatible with various operating systems?
    Answer: Yes, the MT29F4T08CTHBBM5-3C:B is compatible with popular operating systems such as Linux, Windows, and embedded real-time operating systems.

  10. Question: Are there any specific programming requirements for the MT29F4T08CTHBBM5-3C:B?
    Answer: The MT29F4T08CTHBBM5-3C:B requires specific programming techniques and commands to interact with the NAND flash memory, which can be found in the datasheet provided by Micron Technology.