MT29F384G08EBCBBJ4-37ES:B TR

Product Overview

Category: Memory Device
Use: Data storage and retrieval
Characteristics: High capacity, reliable performance
Package: Integrated circuit (IC)
Essence: Non-volatile memory
Packaging/Quantity: Tape and reel packaging, quantity varies

Specifications

• Model: MT29F384G08EBCBBJ4-37ES:B TR
• Capacity: 384 gigabits (48 gigabytes)
• Interface: Parallel NAND Flash
• Voltage: 3.3V
• Operating Temperature: -40°C to +85°C
• Speed: Up to 50 MHz

Detailed Pin Configuration

The MT29F384G08EBCBBJ4-37ES:B TR has the following pin configuration:

1. VCC: Power supply voltage
2. GND: Ground
3. A0-A18: Address inputs
4. DQ0-DQ15: Data inputs/outputs
5. WE#: Write enable
6. CE#: Chip enable
7. RE#: Read enable
8. CLE: Command latch enable
9. ALE: Address latch enable
10. R/B#: Ready/busy status output
11. WP#: Write protect
12. RP#: Reset/power down
13. NC: No connection

Functional Features

• High-speed data transfer
• Reliable data retention
• Error correction code (ECC) support
• Block erase and program operations
• Page read and program operations
• Internal data organization for efficient access

Advantages and Disadvantages

Advantages: - Large storage capacity - Fast data transfer rate - Low power consumption - Compact package size - Wide operating temperature range

Disadvantages: - Relatively high cost compared to other memory options - Limited endurance (number of erase/write cycles)

Working Principles

The MT29F384G08EBCBBJ4-37ES:B TR is based on NAND flash memory technology. It stores data in a non-volatile manner, meaning the data remains intact even when power is removed. The device uses a parallel interface for communication with the host system. It employs various techniques such as error correction codes and wear leveling algorithms to ensure reliable data storage and retrieval.

Detailed Application Field Plans

The MT29F384G08EBCBBJ4-37ES:B TR is widely used in various applications that require high-capacity data storage and fast access times. Some common application fields include:

1. Solid-state drives (SSDs)
2. Embedded systems
3. Automotive electronics
4. Industrial control systems
5. Networking equipment

Detailed and Complete Alternative Models

1. MT29F384G08EBDABJ4-37ES:B TR
   • Similar specifications and features
   • Different package type (BGA instead of TSOP)
2. MT29F384G08EBBABJ4-37ES:B TR
   • Similar specifications and features
   • Different temperature range (extended temperature range)

These alternative models provide similar functionality and can be considered as alternatives to the MT29F384G08EBCBBJ4-37ES:B TR.

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