MT29F256G08EBHAFJ4-3RES:A

Basic Information Overview

• Category: Memory chip
• Use: Data storage in electronic devices
• Characteristics:
  • High capacity (256GB)
  • NAND flash technology
  • Reliable and durable
• Package: Integrated circuit (IC)
• Essence: Non-volatile memory for long-term data retention
• Packaging/Quantity: Single unit

Specifications

• Model: MT29F256G08EBHAFJ4-3RES:A
• Capacity: 256GB
• Technology: NAND flash
• Interface: Parallel
• Voltage: 3.3V
• Operating Temperature: -40°C to +85°C
• Speed: Up to 50MB/s (Read), up to 25MB/s (Write)

Detailed Pin Configuration

1. VCC: Power supply
2. CE: Chip enable
3. CLE: Command latch enable
4. ALE: Address latch enable
5. RE: Read enable
6. WE: Write enable
7. R/B: Ready/busy status
8. DQ0-DQ15: Data input/output lines
9. WP: Write protect
10. GND: Ground

Functional Features

• High-speed data transfer
• Error correction capability
• Wear-leveling algorithm for extended lifespan
• Block management for efficient data organization
• Bad block management for improved reliability

Advantages

• Large storage capacity
• Fast read and write speeds
• Low power consumption
• Compact package size
• High reliability and durability

Disadvantages

• Relatively high cost compared to lower capacity memory chips
• Limited compatibility with certain devices due to the parallel interface

Working Principles

MT29F256G08EBHAFJ4-3RES:A is based on NAND flash technology. It stores data in memory cells organized in a grid-like structure. The data is written and read by applying appropriate voltages to the specific pins of the chip. The non-volatile nature of NAND flash ensures that data remains stored even when power is disconnected.

Detailed Application Field Plans

• Smartphones and tablets
• Solid-state drives (SSDs)
• Digital cameras
• Portable media players
• Industrial control systems

Detailed and Complete Alternative Models

1. MT29F256G08EBHAFJ4-3RES:B
2. MT29F256G08EBHAFJ4-3RES:C
3. MT29F256G08EBHAFJ4-3RES:D
4. MT29F256G08EBHAFJ4-3RES:E

These alternative models have similar specifications and functionality but may differ in certain aspects such as package type or temperature range.

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