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MT29F256G08EBHAFJ4-3R:A TR

MT29F256G08EBHAFJ4-3R:A TR

Basic Information Overview

  • Category: Memory Device
  • Use: Data storage and retrieval
  • Characteristics:
    • Non-volatile
    • High capacity
    • Fast read/write speeds
  • Package: BGA (Ball Grid Array)
  • Essence: Flash memory chip
  • Packaging/Quantity: Individual chip

Specifications

  • Model: MT29F256G08EBHAFJ4-3R:A TR
  • Capacity: 256GB
  • Interface: NAND Flash
  • Voltage: 2.7V - 3.6V
  • Operating Temperature: -40°C to +85°C
  • Speed: Up to 200MB/s (Read), Up to 100MB/s (Write)

Detailed Pin Configuration

The MT29F256G08EBHAFJ4-3R:A TR has a total of 48 pins. The pin configuration is as follows:

  1. VCC
  2. VCCQ
  3. GND
  4. CE#
  5. RE#
  6. WE#
  7. CLE
  8. ALE
  9. WP#
  10. R/B#
  11. DQ0
  12. DQ1
  13. DQ2
  14. DQ3
  15. DQ4
  16. DQ5
  17. DQ6
  18. DQ7
  19. NC
  20. NC
  21. NC
  22. NC
  23. NC
  24. NC
  25. NC
  26. NC
  27. NC
  28. NC
  29. NC
  30. NC
  31. NC
  32. NC
  33. NC
  34. NC
  35. NC
  36. NC
  37. NC
  38. NC
  39. NC
  40. NC
  41. NC
  42. NC
  43. NC
  44. NC
  45. NC
  46. NC
  47. NC
  48. NC

Functional Features

  • High-speed data transfer
  • Reliable and durable
  • Error correction capabilities
  • Wear-leveling algorithms for extended lifespan
  • Power-saving features

Advantages

  • Large storage capacity
  • Fast read/write speeds
  • Low power consumption
  • Compact size
  • Wide operating temperature range

Disadvantages

  • Relatively high cost compared to other memory devices
  • Limited write endurance

Working Principles

The MT29F256G08EBHAFJ4-3R:A TR is based on NAND flash memory technology. It stores data in a series of memory cells organized in a grid-like structure. Each cell can store multiple bits of information, allowing for high-density storage. The data is written and read by applying voltage to specific memory cells. The device utilizes various algorithms and error correction techniques to ensure data integrity and reliability.

Detailed Application Field Plans

The MT29F256G08EBHAFJ4-3R:A TR is widely used in various applications, including: - Solid-state drives (SSDs) - USB flash drives - Memory cards - Embedded systems - Industrial control systems - Automotive electronics

Detailed and Complete Alternative Models

Some alternative models to the MT29F256G08EBHAFJ4-3R:A TR include: - Samsung K9F2G08U0C - Micron MT29F256G08CBABA - Toshiba TH58NVG6D2FLA89 - Intel JS29F256G08CAMD1

(Note: This list is not exhaustive and there may be other alternative models available in the market.)

This entry provides an overview of the MT29F256G08EBHAFJ4-3R:A TR memory device, including its basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT29F256G08EBHAFJ4-3R:A TR v technických řešeních

1. What is the MT29F256G08EBHAFJ4-3R:A TR?

The MT29F256G08EBHAFJ4-3R:A TR is a specific model of NAND flash memory chip manufactured by Micron Technology.

2. What is the storage capacity of the MT29F256G08EBHAFJ4-3R:A TR?

The MT29F256G08EBHAFJ4-3R:A TR has a storage capacity of 256 gigabits (32 gigabytes).

3. What is the interface used by the MT29F256G08EBHAFJ4-3R:A TR?

The MT29F256G08EBHAFJ4-3R:A TR uses a standard NAND flash interface.

4. What is the operating voltage range of the MT29F256G08EBHAFJ4-3R:A TR?

The MT29F256G08EBHAFJ4-3R:A TR operates at a voltage range of 2.7V to 3.6V.

5. What is the maximum data transfer rate of the MT29F256G08EBHAFJ4-3R:A TR?

The MT29F256G08EBHAFJ4-3R:A TR has a maximum data transfer rate of up to 200 megabytes per second.

6. Is the MT29F256G08EBHAFJ4-3R:A TR compatible with different operating systems?

Yes, the MT29F256G08EBHAFJ4-3R:A TR is compatible with various operating systems, including Windows, Linux, and embedded systems.

7. Can the MT29F256G08EBHAFJ4-3R:A TR be used in automotive applications?

Yes, the MT29F256G08EBHAFJ4-3R:A TR is designed to meet the requirements of automotive applications and can be used in such environments.

8. Does the MT29F256G08EBHAFJ4-3R:A TR support wear-leveling algorithms?

Yes, the MT29F256G08EBHAFJ4-3R:A TR supports wear-leveling algorithms to ensure even distribution of data writes across the memory cells, prolonging the lifespan of the chip.

9. What is the temperature range for the operation of the MT29F256G08EBHAFJ4-3R:A TR?

The MT29F256G08EBHAFJ4-3R:A TR has an operating temperature range of -40°C to +85°C.

10. Can the MT29F256G08EBHAFJ4-3R:A TR be used in industrial applications?

Yes, the MT29F256G08EBHAFJ4-3R:A TR is suitable for use in industrial applications due to its wide temperature range and robust design.