MT29F256G08CBCBBJ4-37:B TR

Product Overview

Use

This product is primarily used for data storage in various electronic devices such as smartphones, tablets, digital cameras, and solid-state drives (SSDs).

Characteristics

High storage capacity: The MT29F256G08CBCBBJ4-37:B TR offers a storage capacity of 256 gigabytes (GB), allowing for ample space to store large amounts of data.
Fast data transfer rate: With its advanced architecture, this NAND flash memory provides high-speed data transfer, enabling quick access to stored information.
Reliable performance: The product is designed to deliver reliable performance, ensuring data integrity and durability.
Compact package: The MT29F256G08CBCBBJ4-37:B TR comes in a compact package, making it suitable for integration into small-sized electronic devices.
RoHS compliant: This product adheres to the Restriction of Hazardous Substances (RoHS) directive, ensuring environmental friendliness.

Packaging/Quantity

The MT29F256G08CBCBBJ4-37:B TR is typically packaged in trays or reels, depending on the manufacturer's specifications. The quantity per package varies, but it is commonly available in bulk quantities suitable for industrial production.

Specifications

Part Number: MT29F256G08CBCBBJ4-37:B TR
Memory Type: NAND Flash
Storage Capacity: 256 GB
Interface: Universal Flash Storage (UFS)
Supply Voltage: 2.7V - 3.6V
Operating Temperature Range: -40°C to +85°C
Package Type: Ball Grid Array (BGA)
Package Dimensions: 14mm x 18mm
Data Transfer Rate: Up to 600 megabytes per second (MB/s)
Endurance: Up to 100,000 program/erase cycles

Detailed Pin Configuration

The MT29F256G08CBCBBJ4-37:B TR has a ball grid array (BGA) package with a total of 169 pins. The pin configuration is as follows:

VCCQ
VCC
GND
CE#
RE#
WE#
CLE
ALE
WP#
R/B#
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQS
DQS#
DM
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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT29F256G08CBCBBJ4-37:B TR v technických řešeních

1. What is the MT29F256G08CBCBBJ4-37:B TR?

The MT29F256G08CBCBBJ4-37:B TR is a specific model of NAND flash memory chip manufactured by Micron Technology.

2. What is the storage capacity of the MT29F256G08CBCBBJ4-37:B TR?

The MT29F256G08CBCBBJ4-37:B TR has a storage capacity of 256 gigabits (32 gigabytes).

3. What is the operating voltage range for the MT29F256G08CBCBBJ4-37:B TR?

The operating voltage range for the MT29F256G08CBCBBJ4-37:B TR is typically between 2.7V and 3.6V.

4. What is the maximum data transfer rate of the MT29F256G08CBCBBJ4-37:B TR?

The MT29F256G08CBCBBJ4-37:B TR supports a maximum data transfer rate of up to 400 megabytes per second.

5. What is the interface used by the MT29F256G08CBCBBJ4-37:B TR?

The MT29F256G08CBCBBJ4-37:B TR uses a standard ONFI (Open NAND Flash Interface) 2.3 interface.

6. Is the MT29F256G08CBCBBJ4-37:B TR compatible with various operating systems?

Yes, the MT29F256G08CBCBBJ4-37:B TR is compatible with various operating systems, including Windows, Linux, and embedded systems.

7. Can the MT29F256G08CBCBBJ4-37:B TR be used in industrial applications?

Yes, the MT29F256G08CBCBBJ4-37:B TR is designed for industrial applications and can withstand harsh operating conditions.

8. What is the MTBF (Mean Time Between Failures) of the MT29F256G08CBCBBJ4-37:B TR?

The MTBF of the MT29F256G08CBCBBJ4-37:B TR is typically specified by the manufacturer and may vary depending on the specific application and usage conditions.

9. Does the MT29F256G08CBCBBJ4-37:B TR support hardware encryption?

No, the MT29F256G08CBCBBJ4-37:B TR does not have built-in hardware encryption capabilities.

10. Can the MT29F256G08CBCBBJ4-37:B TR be used as a boot device in embedded systems?

Yes, the MT29F256G08CBCBBJ4-37:B TR can be used as a boot device in embedded systems, provided that the system supports booting from NAND flash memory.