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MT29F1T208ECHBBJ4-3RES:B TR

MT29F1T208ECHBBJ4-3RES:B TR

Product Overview

Category

MT29F1T208ECHBBJ4-3RES:B TR belongs to the category of NAND Flash Memory.

Use

This product is primarily used for data storage in various electronic devices such as smartphones, tablets, digital cameras, and solid-state drives (SSDs).

Characteristics

  • High storage capacity: The MT29F1T208ECHBBJ4-3RES:B TR offers a large storage capacity, ranging from several gigabytes to terabytes.
  • Fast data transfer rate: It provides high-speed data transfer, allowing for quick access and retrieval of stored information.
  • Non-volatile memory: The NAND flash memory retains data even when power is disconnected, making it suitable for long-term storage.
  • Compact package: The product comes in a small form factor, enabling its integration into space-constrained electronic devices.
  • Reliable performance: It offers reliable performance with low error rates and high endurance.

Package and Quantity

The MT29F1T208ECHBBJ4-3RES:B TR is typically packaged in a surface-mount package (SMT) or ball grid array (BGA) package. The quantity may vary depending on the manufacturer's specifications and customer requirements.

Specifications

  • Storage Capacity: Varies (e.g., 16GB, 32GB, 64GB)
  • Interface: NAND
  • Voltage Range: 2.7V - 3.6V
  • Operating Temperature: -40°C to +85°C
  • Data Transfer Rate: Up to 400MB/s (read), up to 200MB/s (write)

Pin Configuration

The detailed pin configuration of the MT29F1T208ECHBBJ4-3RES:B TR can be found in the product datasheet provided by the manufacturer.

Functional Features

  • Page Program Operation: Allows data to be written in page-sized increments.
  • Block Erase Operation: Enables the erasure of multiple pages simultaneously.
  • Read Operation: Facilitates the retrieval of stored data.
  • Wear-Leveling Algorithm: Distributes write operations evenly across memory cells, enhancing longevity.
  • Error Correction Code (ECC): Detects and corrects errors during data transfer, ensuring data integrity.

Advantages and Disadvantages

Advantages

  • High storage capacity for extensive data storage needs.
  • Fast data transfer rate for quick access to stored information.
  • Non-volatile memory ensures data retention even without power.
  • Compact package allows integration into various electronic devices.
  • Reliable performance with low error rates and high endurance.

Disadvantages

  • Limited lifespan due to a finite number of program/erase cycles.
  • Relatively higher cost compared to other types of memory.
  • Susceptible to physical damage if mishandled or exposed to extreme conditions.

Working Principles

The MT29F1T208ECHBBJ4-3RES:B TR utilizes NAND flash memory technology. It stores data by trapping electrons in floating gate transistors within memory cells. When a voltage is applied, the trapped electrons can be read or programmed, allowing for data storage and retrieval.

Detailed Application Field Plans

The MT29F1T208ECHBBJ4-3RES:B TR finds applications in various fields, including: - Consumer electronics: Smartphones, tablets, digital cameras, portable media players. - Computing: Solid-state drives (SSDs), embedded systems, industrial computers. - Automotive: Infotainment systems, navigation systems, advanced driver-assistance systems (ADAS). - Networking: Routers, switches, network attached storage (NAS) devices.

Detailed Alternative Models

Several alternative models to the MT29F1T208ECHBBJ4-3RES:B TR are available in the market, offering similar functionality and performance. Some notable alternatives include: - Samsung K9GAG08U0E - Toshiba TH58NVG6D2ETA20 - Micron MT29F1G08ABADAWP

Please note that the availability and specifications of alternative models may vary depending on the manufacturer and region.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT29F1T208ECHBBJ4-3RES:B TR v technických řešeních

1. What is the MT29F1T208ECHBBJ4-3RES:B TR?

The MT29F1T208ECHBBJ4-3RES:B TR is a specific model of NAND flash memory chip manufactured by Micron Technology.

2. What is the storage capacity of the MT29F1T208ECHBBJ4-3RES:B TR?

The storage capacity of the MT29F1T208ECHBBJ4-3RES:B TR depends on the specific variant, but it typically ranges from 1GB to 128GB.

3. What are the key features of the MT29F1T208ECHBBJ4-3RES:B TR?

Some key features of the MT29F1T208ECHBBJ4-3RES:B TR include high-speed data transfer rates, low power consumption, and advanced error correction capabilities.

4. What applications can the MT29F1T208ECHBBJ4-3RES:B TR be used in?

The MT29F1T208ECHBBJ4-3RES:B TR is commonly used in various technical solutions such as embedded systems, solid-state drives (SSDs), industrial automation, automotive electronics, and consumer electronics.

5. What is the operating voltage range of the MT29F1T208ECHBBJ4-3RES:B TR?

The MT29F1T208ECHBBJ4-3RES:B TR typically operates within a voltage range of 2.7V to 3.6V.

6. What is the interface protocol supported by the MT29F1T208ECHBBJ4-3RES:B TR?

The MT29F1T208ECHBBJ4-3RES:B TR supports the standard NAND flash interface protocol, which includes commands for reading, writing, erasing, and other operations.

7. What is the endurance rating of the MT29F1T208ECHBBJ4-3RES:B TR?

The endurance rating of the MT29F1T208ECHBBJ4-3RES:B TR refers to the number of program/erase cycles it can withstand before potential failure. It typically has a high endurance rating, often exceeding 100,000 cycles.

8. Is the MT29F1T208ECHBBJ4-3RES:B TR compatible with different operating systems?

Yes, the MT29F1T208ECHBBJ4-3RES:B TR is compatible with various operating systems, including Windows, Linux, and embedded operating systems.

9. Can the MT29F1T208ECHBBJ4-3RES:B TR be used in harsh environments?

Yes, the MT29F1T208ECHBBJ4-3RES:B TR is designed to operate reliably in harsh environments, with features such as wide temperature range support and resistance to shock and vibration.

10. Are there any specific precautions or considerations when using the MT29F1T208ECHBBJ4-3RES:B TR?

When using the MT29F1T208ECHBBJ4-3RES:B TR, it is important to follow the manufacturer's guidelines for proper handling, voltage levels, and temperature ranges. Additionally, data backup and error correction mechanisms should be implemented to ensure data integrity and reliability.