M36L0R7050L3ZSE

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory storage and retrieval
• Characteristics: High capacity, fast access speed, low power consumption
• Package: Surface Mount Technology (SMT)
• Essence: Non-volatile memory chip
• Packaging/Quantity: Tape and reel packaging, 1000 units per reel

Specifications

• Memory Capacity: 36 Megabits (4.5 Megabytes)
• Organization: 4M x 9 bits
• Supply Voltage: 2.7V - 3.6V
• Access Time: 70 nanoseconds
• Operating Temperature Range: -40°C to +85°C
• Interface: Serial Peripheral Interface (SPI)

Detailed Pin Configuration

1. VCC: Power supply voltage
2. GND: Ground reference
3. CS: Chip select input
4. SCK: Serial clock input
5. SI: Serial data input
6. SO: Serial data output
7. WP: Write protect input
8. HOLD: Hold input
9. RESET: Reset input

Functional Features

• Non-volatile storage: Retains data even when power is disconnected
• High-speed data transfer: SPI interface enables fast communication
• Low power consumption: Optimized for battery-powered devices
• Write protection: WP pin allows for hardware-based data protection
• Reset functionality: RESET pin resets the device to its initial state

Advantages

• Large storage capacity: 36 Megabits of memory space
• Fast access time: 70 nanoseconds for quick data retrieval
• Compact package: SMT packaging saves board space
• Wide operating temperature range: Suitable for various environments
• Versatile interface: SPI allows easy integration with different systems

Disadvantages

• Limited memory size: May not be sufficient for certain applications
• Serial interface limitations: Slower compared to parallel interfaces
• Vulnerable to external interference: SPI signals can be affected by noise

Working Principles

M36L0R7050L3ZSE is based on Flash memory technology. It utilizes a grid of memory cells, where each cell stores a bit of information as an electrical charge. The data can be written or erased using electrical signals. The SPI interface facilitates communication between the chip and the controlling device, enabling data transfer and memory operations.

Detailed Application Field Plans

• Consumer Electronics: Used in smartphones, tablets, digital cameras for data storage
• Automotive Systems: Employed in infotainment systems, navigation devices for data caching
• Industrial Automation: Utilized in control systems, data loggers for storing critical information
• Medical Devices: Integrated into medical equipment for data retention and retrieval

Detailed and Complete Alternative Models

1. M36L0R7050L3ZTE: Similar specifications but with extended temperature range (-40°C to +105°C)
2. M36L0R7050L3ZPE: Same specifications but with additional write protection features
3. M36L0R7050L3ZNE: Lower capacity variant (18 Megabits) with reduced cost

Note: The above alternative models are provided for reference purposes and may have slight variations in features and availability.

This entry provides comprehensive information about the M36L0R7050L3ZSE memory chip, including its basic overview, specifications, pin configuration, functional features, advantages, disadvantages, working principles, application field plans, and alternative models.