PIC16F1764-I/ML

Product Overview

Category

The PIC16F1764-I/ML belongs to the category of microcontrollers.

Use

This microcontroller is commonly used in various electronic devices and embedded systems for controlling and processing data.

Characteristics

• High-performance 8-bit RISC architecture
• Flash program memory with self-read/write capability
• Low power consumption
• Wide operating voltage range
• Multiple communication interfaces (UART, SPI, I2C)
• Analog-to-Digital Converter (ADC) module
• Enhanced Capture/Compare/PWM (ECCP) module
• Timers and counters
• Integrated EEPROM memory

Package

The PIC16F1764-I/ML is available in a small form factor package known as ML (Micro Leadframe). This package offers excellent thermal performance and is suitable for space-constrained applications.

Essence

The essence of the PIC16F1764-I/ML lies in its ability to provide a cost-effective solution for controlling and managing various functions in electronic devices.

Packaging/Quantity

The PIC16F1764-I/ML is typically sold in reels or tubes, containing a specific quantity of microcontrollers. The exact quantity may vary depending on the manufacturer's specifications.

Specifications

• Microcontroller Family: PIC16F
• Core Size: 8-bit
• Program Memory Size: 14KB
• RAM Size: 1KB
• Number of I/O Pins: 25
• Operating Voltage Range: 1.8V to 5.5V
• Maximum CPU Speed: 32 MHz
• ADC Resolution: 10-bit
• Communication Interfaces: UART, SPI, I2C
• Package Type: ML

Detailed Pin Configuration

The PIC16F1764-I/ML features 25 I/O pins, each serving a specific purpose. The pin configuration is as follows:

1. RA0 - Analog Input/Output
2. RA1 - Analog Input/Output
3. RA2 - Analog Input/Output
4. RA3 - Analog Input/Output
5. RA4 - Analog Input/Output
6. RA5 - Analog Input/Output
7. RC0 - Digital I/O
8. RC1 - Digital I/O
9. RC2 - Digital I/O
10. RC3 - Digital I/O
11. RC4 - Digital I/O
12. RC5 - Digital I/O
13. RC6 - Digital I/O
14. RC7 - Digital I/O
15. RB0 - Digital I/O
16. RB1 - Digital I/O
17. RB2 - Digital I/O
18. RB3 - Digital I/O
19. RB4 - Digital I/O
20. RB5 - Digital I/O
21. RB6 - Digital I/O
22. RB7 - Digital I/O
23. VDD - Power Supply
24. VSS - Ground
25. OSC1/CLKIN - Oscillator Input

Functional Features

The PIC16F1764-I/ML offers a range of functional features that enhance its usability and performance. Some notable features include:

• Flash program memory for storing user code
• EEPROM memory for non-volatile data storage
• Enhanced Capture/Compare/PWM (ECCP) module for precise timing control
• Timers and counters for time-based operations
• Analog-to-Digital Converter (ADC) module for analog signal processing
• Multiple communication interfaces for seamless integration with other devices

Advantages and Disadvantages

Advantages

• High-performance 8-bit RISC architecture ensures efficient execution of instructions.
• Low power consumption makes it suitable for battery-powered applications.
• Wide operating voltage range allows for flexibility in different power supply scenarios.
• Multiple communication interfaces enable easy integration with other devices.
• Compact ML package offers excellent thermal performance and space-saving benefits.

Disadvantages

• Limited program memory size may restrict the complexity of applications.
• 8-bit architecture may not be suitable for computationally intensive tasks.
• Lack of built-in hardware encryption may pose security concerns in certain applications.

Working Principles

The PIC16F1764-I/ML operates based on the principles of a typical microcontroller. It executes instructions stored in its program memory, interacts with various peripherals, and processes data according to the user's program logic. The microcontroller communicates with external devices through its I/O pins and utilizes its internal modules to perform tasks such as analog-to-digital conversion, timing control, and communication protocols.

Detailed Application Field Plans

The PIC16F1764-I/ML finds application in various fields, including but not limited to:

1. Home automation systems
2. Industrial control systems
3. Automotive electronics
4. Medical devices
5. Consumer electronics
6. Internet of Things (IoT) devices