DSPIC33FJ32MC202-H/MM

Product Overview

Category

The DSPIC33FJ32MC202-H/MM belongs to the category of microcontrollers.

Use

This microcontroller is commonly used in various electronic applications that require high-performance processing capabilities.

Characteristics

• High-speed processing: The DSPIC33FJ32MC202-H/MM offers a high clock frequency, enabling fast execution of instructions.
• Enhanced peripherals: It features a wide range of integrated peripherals, including analog-to-digital converters, timers, and communication interfaces.
• Low power consumption: The microcontroller is designed to operate efficiently with minimal power consumption.
• Robust architecture: It incorporates a robust architecture that ensures reliable operation even in demanding environments.

Package

The DSPIC33FJ32MC202-H/MM is available in a compact surface-mount package, making it suitable for space-constrained applications.

Essence

The essence of this microcontroller lies in its ability to provide advanced processing capabilities in a small form factor, making it ideal for embedded systems.

Packaging/Quantity

The DSPIC33FJ32MC202-H/MM is typically sold in reels or trays, with quantities varying depending on the supplier.

Specifications

• Microcontroller Family: dsPIC33F
• Core Size: 16-bit
• CPU Speed: Up to 40 MHz
• Program Memory Size: 32 KB
• RAM Size: 2 KB
• Number of I/Os: 28
• Operating Voltage Range: 2.5V to 5.5V
• Temperature Range: -40°C to +85°C
• Communication Interfaces: UART, SPI, I2C
• Analog-to-Digital Converter (ADC) Resolution: 10-bit
• Timers: 4 x 16-bit, 1 x 32-bit

Detailed Pin Configuration

The DSPIC33FJ32MC202-H/MM features a total of 28 pins, each serving a specific purpose. The pin configuration is as follows:

1. VDD - Power supply voltage
2. VSS - Ground
3. RA0 - General-purpose I/O
4. RA1 - General-purpose I/O
5. RA2 - General-purpose I/O
6. RA3 - General-purpose I/O
7. RA4 - General-purpose I/O
8. RA5 - General-purpose I/O
9. RB0 - General-purpose I/O
10. RB1 - General-purpose I/O
11. RB2 - General-purpose I/O
12. RB3 - General-purpose I/O
13. RB4 - General-purpose I/O
14. RB5 - General-purpose I/O
15. RB6 - General-purpose I/O
16. RB7 - General-purpose I/O
17. RB8 - General-purpose I/O
18. RB9 - General-purpose I/O
19. RB10 - General-purpose I/O
20. RB11 - General-purpose I/O
21. RB12 - General-purpose I/O
22. RB13 - General-purpose I/O
23. RB14 - General-purpose I/O
24. RB15 - General-purpose I/O
25. VCAP - Capacitor connection for internal voltage regulator
26. AVDD - Analog power supply voltage
27. AVSS - Analog ground
28. OSC1/CLKI - Oscillator input

Functional Features

• High-performance processing: The DSPIC33FJ32MC202-H/MM offers a 16-bit core with a maximum clock frequency of 40 MHz, enabling efficient execution of complex algorithms.
• Enhanced peripherals: It includes multiple communication interfaces (UART, SPI, I2C), timers, and an analog-to-digital converter (ADC) for versatile connectivity and data acquisition.
• Advanced interrupt handling: The microcontroller supports multiple interrupt sources, allowing efficient handling of time-critical events.
• Flexible power management: It incorporates various power-saving modes to optimize energy consumption in battery-powered applications.
• Robust protection mechanisms: The DSPIC33FJ32MC202-H/MM features built-in security features, such as code protection and memory access control, ensuring the integrity of the system.

Advantages and Disadvantages

Advantages

• High-speed processing capabilities
• Wide range of integrated peripherals
• Low power consumption
• Compact form factor
• Robust architecture for reliable operation

Disadvantages

• Limited program memory size (32 KB)
• Relatively small RAM size (2 KB)

Working Principles

The DSPIC33FJ32MC202-H/MM operates based on the principles of a 16-bit microcontroller. It executes instructions stored in its program memory, performs calculations, and interacts with external devices through its integrated peripherals. The microcontroller's core processes data and controls the flow of information within the system, enabling the desired functionality.

Detailed Application Field Plans