IDT71V3559SA75BQGI8

Product Overview

Category: Integrated Circuit (IC)
Use: Memory device
Characteristics: High-speed, low-power, synchronous SRAM
Package: BGA (Ball Grid Array)
Essence: Provides fast and reliable data storage and retrieval capabilities
Packaging/Quantity: Available in tape and reel packaging, quantity varies based on customer requirements

Specifications

Memory Type: Synchronous SRAM
Memory Size: 4 Megabits (512K x 8)
Operating Voltage: 3.3V
Access Time: 7.5 ns
Operating Temperature Range: -40°C to +85°C
Interface: Parallel
Data Retention: 10 years
Package Dimensions: 13mm x 15mm

Pin Configuration

The IDT71V3559SA75BQGI8 has a total of 119 pins. The pin configuration is as follows:

VCC
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
WE#
OE#
UB#
LB#
CE#
ZZ#
CLK
CLKEN#
CKE#
CS#
RAS#
CAS#
WEN#
OEN#
BHE#
BLE#
BYTE#
ADSP#
ADSC#
ADSPC#
ADSCC#
ADSPB#
ADSBB#
ADSPA#
ADSAA#
ADSPD#
ADSDD#
ADSPF#
ADSFF#
ADSPG#
ADSGG#
ADSPH#
ADSHH#
ADSPJ#
ADSJJ#
ADSPK#
ADSKK#
ADSPM#
ADSMM#
ADSPN#
ADSNN#
ADSPR#
ADSRR#
ADSPS#
ADSSS#
ADSPU#
ADSUU#
ADSPV#
ADSVV#
ADSPW#
ADSWW#
ADSPX#
ADSXX#
GND

Functional Features

High-speed operation: The IDT71V3559SA75BQGI8 offers fast access times, allowing for quick data retrieval and storage.
Low-power consumption: Designed with power efficiency in mind, this memory device minimizes energy usage.
Synchronous operation: The device synchronizes its operations with an external clock signal, ensuring reliable data transfer.
Easy integration: The parallel interface simplifies the integration of the IDT71V3559SA75BQGI8 into various systems.

Advantages and Disadvantages

Advantages: - Fast access times enable efficient data processing. - Low-power consumption reduces energy costs. - Synchronous operation ensures reliable data

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací IDT71V3559SA75BQGI8 v technických řešeních

Sure! Here are 10 common questions and answers related to the application of IDT71V3559SA75BQGI8 in technical solutions:

Question: What is IDT71V3559SA75BQGI8?
Answer: IDT71V3559SA75BQGI8 is a specific model of synchronous SRAM (Static Random Access Memory) chip manufactured by Integrated Device Technology (IDT).
Question: What is the capacity of IDT71V3559SA75BQGI8?
Answer: The IDT71V3559SA75BQGI8 has a capacity of 4 Megabits (512K x 8 bits).
Question: What is the operating voltage range for IDT71V3559SA75BQGI8?
Answer: The operating voltage range for IDT71V3559SA75BQGI8 is typically between 3.0V and 3.6V.
Question: What is the access time of IDT71V3559SA75BQGI8?
Answer: The access time of IDT71V3559SA75BQGI8 is 7.5 ns, which refers to the time it takes for data to be accessed from the memory.
Question: Can IDT71V3559SA75BQGI8 be used in industrial applications?
Answer: Yes, IDT71V3559SA75BQGI8 is suitable for use in industrial applications due to its wide operating temperature range and robust design.
Question: Does IDT71V3559SA75BQGI8 support multiple read and write operations simultaneously?
Answer: No, IDT71V3559SA75BQGI8 is a synchronous SRAM and does not support simultaneous read and write operations.
Question: Can IDT71V3559SA75BQGI8 be used in battery-powered devices?
Answer: Yes, IDT71V3559SA75BQGI8 can be used in battery-powered devices as it operates within a low voltage range and has low power consumption.
Question: What is the package type for IDT71V3559SA75BQGI8?
Answer: IDT71V3559SA75BQGI8 comes in a 119-ball BGA (Ball Grid Array) package.
Question: Is IDT71V3559SA75BQGI8 pin-compatible with other SRAM chips?
Answer: No, IDT71V3559SA75BQGI8 has its own specific pin configuration and is not pin-compatible with other SRAM chips.
Question: Can IDT71V3559SA75BQGI8 be used in high-speed data processing applications?
Answer: Yes, IDT71V3559SA75BQGI8 has a fast access time and can be used in high-speed data processing applications such as networking equipment or telecommunications systems.

Please note that these answers are general and may vary depending on the specific requirements and use cases of your technical solution.