Encyclopedia Entry: 71V25761S200PFG

Product Information Overview

Category: Integrated Circuit (IC)

Use: The 71V25761S200PFG is a high-speed, low-power CMOS static random access memory (SRAM) IC. It is designed for use in various electronic devices and systems that require fast and reliable data storage.

Characteristics: - High-speed operation - Low power consumption - Large storage capacity - Reliable data retention - Easy integration into existing circuitry

Package: The 71V25761S200PFG is available in a compact and durable plastic package, which provides protection against environmental factors such as moisture and dust. The package also facilitates easy installation and soldering onto printed circuit boards.

Essence: This IC serves as a crucial component in electronic devices by providing fast and efficient data storage capabilities. Its high-speed operation and low power consumption make it suitable for a wide range of applications.

Packaging/Quantity: The 71V25761S200PFG is typically sold in reels or trays, containing a specific quantity of ICs per package. The exact packaging and quantity may vary depending on the supplier and customer requirements.

Specifications

• Memory Type: Static Random Access Memory (SRAM)
• Organization: 256K x 16 bits
• Supply Voltage: 3.3V
• Access Time: 10 ns
• Operating Temperature Range: -40°C to +85°C
• Package Type: Plastic Fine-Pitch Ball Grid Array (FBGA)
• Pin Count: 100 pins

Detailed Pin Configuration

The 71V25761S200PFG has a total of 100 pins, each serving a specific function. Here is a brief overview of the pin configuration:

1. VDD: Power supply voltage
2. VSS: Ground reference
3. A0-A17: Address inputs
4. DQ0-DQ15: Data input/output lines
5. WE: Write enable
6. OE: Output enable
7. CE1, CE2: Chip enable inputs
8. UB/LB: Byte control inputs
9. CLK: Clock input
10. NC: No connection (reserved pin)

Please refer to the datasheet or technical documentation for a complete and detailed pin configuration diagram.

Functional Features

• High-speed operation allows for quick data access and retrieval.
• Low power consumption ensures efficient energy usage in battery-powered devices.
• Large storage capacity of 256K x 16 bits provides ample space for data storage needs.
• Reliable data retention ensures that stored information remains intact over extended periods.
• Easy integration into existing circuitry simplifies the design and implementation process.

Advantages and Disadvantages

Advantages: - Fast and efficient data storage capabilities - Low power consumption - Reliable data retention - Easy integration into existing circuitry

Disadvantages: - Limited storage capacity compared to higher-capacity memory options - Higher cost per unit compared to some alternative models

Working Principles

The 71V25761S200PFG operates based on the principles of static random access memory (SRAM). It utilizes flip-flops to store and retrieve data. When an address is provided, the corresponding data is accessed from the memory array and made available on the output pins. The IC also incorporates various control signals to manage read and write operations.

Detailed Application Field Plans

The 71V25761S200PFG finds applications in various electronic devices and systems, including but not limited to: - Computer systems - Networking equipment - Telecommunications devices - Consumer electronics - Automotive electronics - Industrial control systems

Its high-speed operation, low power consumption, and reliable data retention make it suitable for applications that require fast and efficient data storage.

Detailed and Complete Alternative Models

• 71V25761S200BFG: Similar to the 71V25761S200PFG, but with a different package type (BGA instead of FBGA).
• 71V25761S200RFG: Similar to the 71V25761S200PFG, but with extended temperature range (-40°C to +125°C).
• 71V25761S200DFG: Similar to the 71V25761S200PFG, but with lower power consumption.
• 71V25761S200NFG: Similar to the 71V25761S200PFG, but with higher storage capacity (512K x 16 bits).

These alternative models offer variations in package type, temperature range, power consumption, and storage capacity to cater to specific application requirements.

Note: The above information is provided as a general overview. For detailed specifications and compatibility, refer to the respective datasheets and technical documentation provided by the manufacturer.