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CY7C1512KV18-300BZXC

CY7C1512KV18-300BZXC

Product Overview

Category

The CY7C1512KV18-300BZXC belongs to the category of high-performance synchronous static random access memory (SRAM) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices such as computers, servers, networking equipment, and telecommunications systems.

Characteristics

  • High Performance: The CY7C1512KV18-300BZXC offers fast access times and low latency, making it suitable for time-critical operations.
  • Large Capacity: With a capacity of 1,048,576 bits (128K x 8), this SRAM chip provides ample storage space for data-intensive applications.
  • Low Power Consumption: The device is designed to operate efficiently, minimizing power consumption and extending battery life in portable devices.
  • Wide Temperature Range: The CY7C1512KV18-300BZXC can function reliably across a wide temperature range, making it suitable for use in harsh environments.
  • RoHS Compliant: This product adheres to the Restriction of Hazardous Substances directive, ensuring its environmental friendliness.

Package

The CY7C1512KV18-300BZXC is available in a compact BGA (Ball Grid Array) package. This package type offers excellent thermal performance and facilitates easy integration into circuit boards.

Essence

The essence of the CY7C1512KV18-300BZXC lies in its ability to provide high-speed, non-volatile data storage with low power consumption, making it an essential component in modern electronic systems.

Packaging/Quantity

This SRAM chip is typically packaged in reels or trays, depending on the manufacturer's specifications. The quantity per package varies but is usually in the range of several hundred to several thousand units.

Specifications

  • Organization: 128K x 8 bits
  • Access Time: 18 ns
  • Voltage Supply: 3.3V
  • Operating Temperature Range: -40°C to +85°C
  • Standby Current: 10 μA (typical)
  • Package Type: BGA
  • Pin Count: 119

Detailed Pin Configuration

The CY7C1512KV18-300BZXC features a total of 119 pins, each serving a specific function. The detailed pin configuration is as follows:

(Pin Number) - (Pin Name) - (Function) 1 - VDDQ - Power Supply for I/O Buffers 2 - VSSQ - Ground for I/O Buffers 3 - DQ0-DQ7 - Data Input/Output Pins 4 - VDDQ - Power Supply for I/O Buffers 5 - VSSQ - Ground for I/O Buffers 6 - DQ8-DQ15 - Data Input/Output Pins ... 119 - VDD - Power Supply (Note: This is just a partial representation of the pin configuration.)

Functional Features

The CY7C1512KV18-300BZXC offers several functional features that enhance its performance and usability:

  1. Burst Mode Operation: This SRAM chip supports burst mode operation, allowing for efficient consecutive data transfers.
  2. Write Protection: It provides write protection functionality to prevent accidental modification or corruption of stored data.
  3. Asynchronous Output Enable: The device supports asynchronous output enable control, enabling flexible data retrieval operations.
  4. Automatic Power Down: When not in use, the CY7C1512KV18-300BZXC automatically enters a low-power standby mode, conserving energy.

Advantages and Disadvantages

Advantages

  • High-speed access and low latency ensure quick data retrieval.
  • Large storage capacity accommodates data-intensive applications.
  • Low power consumption extends battery life in portable devices.
  • Wide temperature range allows for reliable operation in various environments.
  • RoHS compliance ensures environmental friendliness.

Disadvantages

  • Relatively higher cost compared to other memory technologies.
  • Limited scalability beyond the specified capacity.

Working Principles

The CY7C1512KV18-300BZXC operates based on the principles of static random access memory. It utilizes flip-flops to store and retrieve data, providing fast and reliable access times. The device relies on a stable power supply and proper control signals to ensure accurate data storage and retrieval.

Detailed Application Field Plans

The CY7C1512KV18-300BZXC finds application in various fields that require high-performance data storage and retrieval capabilities. Some detailed application field plans include:

  1. Computer Systems: This SRAM chip is used in computer systems to provide fast cache memory for efficient data processing.
  2. Networking Equipment: It is employed in networking devices such as routers and switches to facilitate quick data packet handling.
  3. Telecommunications Systems: The CY7C

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací CY7C1512KV18-300BZXC v technických řešeních

Sure! Here are 10 common questions and answers related to the application of CY7C1512KV18-300BZXC in technical solutions:

  1. Question: What is the maximum operating frequency of CY7C1512KV18-300BZXC?
    Answer: The maximum operating frequency of CY7C1512KV18-300BZXC is 300 MHz.

  2. Question: What is the voltage supply range for CY7C1512KV18-300BZXC?
    Answer: CY7C1512KV18-300BZXC operates with a voltage supply range of 1.7V to 1.9V.

  3. Question: How much memory does CY7C1512KV18-300BZXC have?
    Answer: CY7C1512KV18-300BZXC has a memory capacity of 2 Megabits (256K x 8).

  4. Question: Can CY7C1512KV18-300BZXC be used in automotive applications?
    Answer: Yes, CY7C1512KV18-300BZXC is suitable for automotive applications as it meets the required specifications.

  5. Question: Does CY7C1512KV18-300BZXC support industrial temperature range?
    Answer: Yes, CY7C1512KV18-300BZXC is designed to operate within the industrial temperature range of -40°C to +85°C.

  6. Question: What is the access time of CY7C1512KV18-300BZXC?
    Answer: The access time of CY7C1512KV18-300BZXC is 18 ns.

  7. Question: Can CY7C1512KV18-300BZXC be used in low-power applications?
    Answer: Yes, CY7C1512KV18-300BZXC has low-power features and can be used in low-power applications.

  8. Question: Does CY7C1512KV18-300BZXC support multiple read and write operations simultaneously?
    Answer: Yes, CY7C1512KV18-300BZXC supports simultaneous multiple read and write operations.

  9. Question: What is the package type of CY7C1512KV18-300BZXC?
    Answer: CY7C1512KV18-300BZXC comes in a 119-ball BGA (Ball Grid Array) package.

  10. Question: Is CY7C1512KV18-300BZXC compatible with other memory devices?
    Answer: Yes, CY7C1512KV18-300BZXC is compatible with other memory devices and can be easily integrated into existing systems.

Please note that these answers are based on general information about CY7C1512KV18-300BZXC and may vary depending on specific application requirements.